Lab tool and fully automated acoustic microscopes

  • DESCRIPTION: Our systems enable you to check: Wafers and bonded wafers MEMS Die structures Stack dies Flip Chips Power electronics CMOS Image Sensors Molded Components Packaging
  • Nation of Principal:Germany
    Product Application:Semiconductor
    Related Link:
    Keyword:Scanning Acoustic Tomography(SAT);  scanning acoustic microscope(SAM)

Detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and package inspection