1.4-Axis Horizontal and Multi-Joint Type Clean Robot GCR4000-PM
2.Designed for handling 300mm wafers in a production line or inspection line of semiconductor
3.Arm lineup: 210mm
4.2FOUP access is available without a track.
5.Vertical Stroke 300mm
6.Payload Capacity Below 3kgf (calculated for the arm 3rd joint)
7.Motion monitoring available.
8.2-phase stepping motor with absolute encoders installed in all axes.
9.High-speed, high-accuracy wafer handling by S-curved speed control
10.Offset movement is 1.4 times faster compared to GHR4000 type
11.Optimal end-effector is able according to the carrying object and line layout
12.Base or flange mounting type is able
13.Power: DC24V±10% 15A; Vacuum: -53kPa or more
14.Interface：RS232C and parallel photo I/O