Used EquipmentUsed Equipment
Vintage: 2012
Wafer Inspection / Scanner
System Components and Configuration
1. Bump inspection system, 12"
2. XPort, wafer scanner, ISO class 1
3. EFEM Outfitted with a dual arm robot
4. XPort capable of handling:
5. Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers
6. Brooks Vision 12" load ports