Compound SemiconductorJEL
Characteristics:
Bernoulli pad type or Cyclone pad type is able depending on the wafer condition
①Bernoulli pad type
1.Low cost end-effector for thin or warped wafers
2.Capable to handle various sizes or types of wafers
3.Wafers can be lifted with low stress to minimize damage
4.Thickness of the end-effector can be reduced
②Cyclone pad type
1.Cyclone pads (Dia: 25mm; Thickness: 2.5mm) are used
2.Capable to handle various sizes or types of wafers,
3. and available for the Bernoulli type aligner
4.Stronger holding of wafers compared to the Bernoulli type end-effector