Compound SemiconductorJEL
1.5-Axis Horizontal and Multi-Joint Type Clean Robot for 300mm wafer
2.A twin end-effector mounted on its single-arm has the same function as a twin-arm robot.
3.Designed for handling 300mm wafers in a production line or inspection line of semiconductor
4.Arm lineup: 210mm, 280mm
5.3 FOUP access is available without a track
6.Vertical Stroke 300mm
7.Payload Capacity Below 4kgf (calculated for the arm 3rd joint)
8.Twin end-effector reduces the wafer swap time
9.Motion monitoring is available
10.AC servo motors with absolute encoders installed in all axes
11.High-speed, high-accuracy wafer handling by S-curved speed control and optimizing pass control
12.Wafer holding: end-effector with vacuum suction, passive edge, edge grip, or Bernoulli type End-effector
13.End-effector material: CFRP, Al, ceramic, or others
14.Base or flange mounting type is able
15.Power: AC200V Single phase ±10% 4kVA; Vacuum: -53kPa or more
16.Interface:RS232C and parallel photo I/O